Amkor Technology, Inc. engages in the provision of outsourced semiconductor packaging and test services. The company is headquartered in Tempe, Arizona and currently employs 28,300 full-time employees. The firm is engaged in the outsourcing of semiconductor packaging and test services. The company designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. The company provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The firm offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. The company allows IDMs to outsource packaging and test services and focus their investments.