ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The firm's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The firm also provides customers with full-stage processing and distribution services. The firm mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.