Shennan Circuits Co Ltd. Stock Analysis 002916.SZ

Shennan Circuits Co., Ltd. engages in the production and sales of printed circuit boards, packaging substrates, and electronic assembly products. The company is headquartered in Shenzhen, Guangdong and currently employs 21,211 full-time employees. The company went IPO on 2017-12-13. The firm operates its business through three segments. The PCB segment is engaged in the design, development and manufacture of PCBs, with the products mainly used in aerospace and industrial control industries. The Package Substrate segment is mainly engaged in the chip design, wafer manufacturing and packaging test businesses. The Surface Mounting segment is mainly engaged in the welding of passive components, active devices, connectors and other electronic components on PCBs. The firm distributes its products in domestic market and to overseas markets.